Beitrag in Festschrift (1)

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Beitrag in Festschrift
Masselot, C.; Dammann, R.: Le Principe Par Condicio Creditorium Dans Le Nouveau Droit De La Restructuration : Une Étude Comparative Franco-allemande. In: L’effervescence Du Droit Des Affaires Au XXIe Siècle : Mélanges En L’honneur Du Professeur Arlette Martin-Serf, S. 345 - 362. Bruylant, Bruxelles (2022)

Beitrag in Lexikon (2)

6482.
Beitrag in Lexikon
Cini, L.; Tassinari, A.: Trade Unions in the Gig Economy. In: The Wiley-Blackwell Encyclopedia of Social and Political Movements (Hg. Snow, D. A.; della Porta, D.; McAdam, D.; Klandermans, B.). Wiley-Blackwell, Chicester (2022)
6483.
Beitrag in Lexikon
Marktanner, A.: Kienbaum, Gerhard. In: NDB-online (2022)

Editorial (17)

6484.
Editorial
Kavokine, N.: When ions break the law. Nature Nanotechnology 18, S. 102 - 103 (2022)
6485.
Editorial
Grohmann, K. K.; Kambanaros, M.; Leivada, E.; Samuels, B.; Trettenbrein, P.: Biolinguistics end-of-year notice 2022. Biolinguistics 16, e10823 (2022)
6486.
Editorial
Henriques, R.; Calderan-Rodrigues, M.J.; Luis Crespo, J.; Baena-González, E.; Caldana, C.: Growing of the TOR world. Journal of Experimental Botany 73 (20), S. 6987 - 6992 (2022)
6487.
Editorial
Sela-Vasiliu, S.; Miehl, C.; Huygelier, H.; Oren-Suissa, M.; Gjorgjieva, J.; Gillebert, C. R.: FENS-Kavli Network of Excellence: Mentorship during the COVID-19 pandemic: Perspectives, challenges and opportunities. Eur. J. Neurosci, S. 1 - 9 (2022)
6488.
Editorial
Li, M.; Bin, H.; Marszalek, T.: Editorial: Molecular Design and Morphology Control of Semiconducting Polymers for High-Performance Transistors and Photovoltaics. Frontiers in Chemistry 10, 940253 (2022)
6489.
Editorial
Guo-Qiang, P. L.; Hu, J.; Xian-Shu, L.; Poon, J.; Van Thourhout, D.; Xia, F.: Welcome to the IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) Special Issue on Hybrid Integration for Silicon Photonics (HISP). IEEE Journal of Selected Topics in Quantum Electronics 28 (3), 0200304 (2022)
6490.
Editorial
Bronner, M.; Meijer, G.; Yam, V.; Friedrich, B.: UNESCO issues a powerful endorsement of Open Science. Natural Sciences 2 (1), e10037 (2022)
6491.
Editorial
Farris, S.; Hacisuleyman, E.; Donlin-Asp, P.; Cioni, J.-M.: Editorial: RNA Localization and Localized Translation in Neurons. Front Integr Neurosci 15, 831038 (2022)
6492.
Editorial
Beattie, C.; Benner, P.; Embree, M.; Gugercin, S.; Lefteriu, S.: Preface: Rational and Systematic - A Mathematical Biography of Thanos Antoulas. Realization and Model Reduction of Dynamical Systems, S. vii - xv (2022)
6493.
Editorial
Benner, P.; Cai, X.-C.; Klawonn, A.: Preface to Special Volume on Scientific Machine Learning. Electronic Transactions on Numerical Analysis: Special Issue SciML 56, S. viii (2022)
6494.
Editorial
Obradovich, N.; Minor, K.: Identifying and preparing for the mental health burden of climate change. JAMA Psychiatry 79 (4), S. 285 - 286 (2022)
6495.
Editorial
Samman, A.; Boy, N.; Coombs, N.; Hager, S.; Hayes, A.; Rosamond, E.; Wansleben, L.; Westermeier, C.: After the Boom: Finance and Society Studies in the 2020s and Beyond. Finance and Society 8 (2), S. 93 - 109 (2022)
6496.
Editorial
Schmid, F.: Editorial: Multiscale simulation methods for soft matter systems. Journal of Physics: Condensed Matter 34 (16), 160401 (2022)
6497.
Editorial
Sundmacher, K.; Engell, S.; Kraume, M.: Virtual special issue: Process Systems Engineering (PSE) meets green chemistry. Chemical Engineering Science 256, 117571 (2022)
6498.
Editorial
Trbojević-Akmačić, I.; Abdel-Mohsen, M.; Falck, D.; Rapp, E.: Editorial: Immunoglobulin Glycosylation Analysis: State-of-the-Art Methods and Applications in Immunology. Frontiers in Immunology 13, 923393 (2022)
6499.
Editorial
Zhang, Q.; Hu, W.; Sirringhaus, H.; Müllen, K.: Recent Progress in Emerging Organic Semiconductors. Advanced Materials 34 (22), 2108701 (2022)
6500.
Editorial
Zhou, T.; Sundmacher, K.: Multiscale process systems engineering—analysis and design of chemical and energy systems from molecular design up to process optimization. Frontiers of Chemical Science and Engineering 16, S. 137 - 140 (2022)
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