Research report 2025 - Max Planck Institute for Sustainable Materials GmbH
Crash test on the microscale: when the smartphone hits the floor
Authors
Bellón, Bárbara; Bhaskar, Lalith Kumar; Brink, Tobias; Aymerich-Armengol, Raquel; Sonawane, Dipali; Chatain, Dominique; Dehm, Gerhard; Ramachandramoorthy, Rajaprakash;
Departments
Struktur und Nano-/Mikromechanik von Materialien
Summary
What happens to a smartphone when it falls and hits the floor? Or inside a satellite as it travels through the freezing cold of outer space? Electronics are made of tiny metal components that must survive shocks, impacts, and extreme temperature changes. We compress tiny nickel particles – major components in these electronics – over a wide range of loading speeds and temperatures. Our results show us how to tune their surface morphology to make micro electronics more resilient and durable.