Microsystems Packaging Research Engineer (m/f/d)

Young Researchers Halle (Saale)
Solid State Research & Material Sciences Particle, Plasma and Quantum Physics

Job Code: MPI-Halle-PKG

Job Offer from October 04, 2019

The Max Planck Institute of Microstructure Physics, Halle, Germany, Department of Nanophotonics, Integration, and Neural Technology, is recruiting a Microsystems Packaging Research Engineer (m/f/d) to design and implement packaging solutions for multifunctional micro- and nano-scale devices. Our new Department is initiating research programs on nanoscale devices and microsystems for future computing and brain activity mapping technologies. We are creating microchips for brain implants and brain-computer interfaces, microdisplays, sensing, and neuromorphic computing.  These microchips often co-integrate multiple technologies, such as photonics, electronics, MEMS, and microfluidics. To be useful, these microchips must be packaged to interface with the rest of the system, such as other microelectronic circuits, cables, connectors, fiber optics.

Your tasks

  • Design, develop, and implement packaged microsystems for microchips with photonic, electronic, and microfluidic functionalities
  • Simulate and model system-in-package for thermal, mechanical, optical, electrical, fluid flow properties
  • Package microchips with carriers, rigid & flexible printed circuit boards, connectors, flexible cables, optical fibers, lenses, fluidic tubing, etc. using a combination of wirebonding, flip-chip bonding, adhesive bonding, 3D printing, 3D laser writing techniques
  • Assist in establishing the packaging facility in the NINT Department

Your profile

  • You have 2+ years of work experience in optoelectronic, optical, electronic, MEMS, and/or microfluidic packaging
  • You have experience in assembly processes such as wafer grinding, dicing, die attach, fiber attach, die-stacking of thin dies, flip-chip bond, wire-bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, pick-and-place, singulation
  • You are experienced with mechanical CAD tools such as AutoCAD/Solidworks
  • Prior experiences in modelling and resolving issues related to thermal and mechanical stresses (e.g., using COMSOL), optical propagation (e.g., Zemax) are strong assets
  • Prior experiences in the design and test of biomedical implants are assets
  • You are motivated by grand challenges
  • You are a fast learner and excited to learn about other disciplines
  • You are an effective team player that excels in a fast-paced, highly dynamic, interdisciplinary and international environment
  • You have good written and oral communication skills in English

We offer

  • The opportunity to work at the forefront of scientific research with an incredible team of highly motivated and smart people
  • Remuneration and social benefits according to TVöD
  • Fixed-term contract initially for 2 years, with the potential of extension
  • Expected start date: January 2020, negotiable

Your application

Please submit your resume with the names of two references to jobs.nint@mpi-halle.mpg.de referencing MPI-Halle-PKG. The position will remain open until closed.

The Max Planck Society aims to employ more persons with disabilities and increase the number of women in those areas where they are underrepresented; thus, applications from persons with disabilities and women are encouraged.

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